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CEM launches Out-of-Autoclave Toughened Epoxy
Resin Prepreg System for
Primary Structures
CYCOM® 5320 is Cytec
Engineered Materials’ newest toughened epoxy resin prepreg
system. Designed specifically for out-of-autoclave (OOA)
manufacturing, CYCOM 5320 provides autoclave-type material
performance with the benefit of lower processing costs and
manufacturing flexibility. This material allows for the design
of large primary structures, without the autoclave costs and
size limitations.
The low temperature
curing capability of CYCOM 5320, coupled with the cost benefits,
makes it ideal for many structural aerospace applications. Low
cost tooling and OOA curing offers the distinct advantage of
using one material for both prototype and high-rate production.
CYCOM 5320 offers the
mechanical performance equivalent to 350°F/180°C
autoclave-cured, toughened epoxy prepreg systems. With CYCOM
5320, you have the flexibility to vary the cure cycle from
200°F/8hr to 250°F/2hr (followed by a 350°F two-hour post cure).
This flexibility provides a broad processing window with
maximized mechanical properties. As CYCOM 5320 can be vacuum bag
cured to produce autoclave-quality components, the non-recurring
costs reduction offers a tangible financial benefit.
Non-Autoclave Manufacturing Technology is jointly accomplished by a
Boeing-led team and the U.S. Government (Defence Advanced
Research Projects Agency Defence Science Office, DARPA/DSO)
under the guidance of the U.S. Air Force through
FA8650-07-2-7716.
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