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Resin Infusion Materials

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Cytec Engineered Materials has developed a range of products for use in a variety of resin infusion processes, such as Resin Transfer Moulding (RTM), Vacuum Assisted RTM (VARTM), Resin Infusion under Flexible Tooling (RIFT), etc. These products are aimed to complement our existing, market leading range of composite prepreg materials. They have been developed to meet specific customer requests for improved processability and performance systems, leading to greater flexibility of design for composite component manufacture.

Resin Infusion Materials Summary

Product
Description

CYCOM PR 520 RTM

One-part, room temperature stable epoxy resin, requiring no mixing. Offers a very low injection viscosity and unusually long out-time at ambient temperatures. Hot/wet service >220ºF (104ºC)

CYCOM 5250-4 RTM Bismaleimide resin for up to 400ºF/204ºC continuous service.

CYCOM 5270-1 RTM

Bismaleimide resin for up to 450ºF/232ºC continuous service.
CYCOM 782 RTM Modified BMI preform binder for use with 5250-4 RTM, 5280-1 RTM and 824 RTM.
CYCOM 823 RTM 250ºF/125ºC cure epoxy resin for up to 195ºF/90º C continuous service.
CYCOM 875 RTM 250ºF/125ºC cure + 355ºF/180ºC postcure epoxy resin for up to 230º F/110º C continuous service.
CYCOM 890 RTM 355ºF/180ºC cure epoxy resin for up to 300ºF/150ºC continuous service.
CYCOM 790 RTM Modified epoxy preform binder for use with 823 RTM, 875 RTM and 890 RTM.
CYCOM 5555 RTM 320ºF/160ºC cure, low moisture absorption, epoxy resin for up to 284ºF/140ºC continuous service, and particularly targeted for space applications.
CYCOM 5575-1 RTM 350ºF/175ºC cure cyanate ester resin for up to 350ºF/175ºC continuous service, and particularly targeted for space applications.
Properties
RTM Resins
No of components
One
One
One
One
Out-life at RT
>1 month
>1 month
>1 month
>1 month
Storage life at 0ºF
12 months
12 months
12 months
12 months
Injection temp (ºF/ºC)
200/93
140/60
175/79
330/166
Viscosity at injection temp (cps)
300
200
250
200
Potlife at injection temp (hrs. below 500 cps)
3.5
> 12
> 24
1
Cure temp   (ºF/ºC)
350 (1)/177
250/121
350/177
355/179
Cure time (hrs)
6 (1)
1
2
2
Post cure (ºF/ºC)
4 hrs. at 440ºF(1)/227
1 hr. at 355/179
Optional 2 hrs. at 390ºF(2)/199
N/A
Tensile strength (MPa)
103.7
48.0
70.5
92.9
Tensile modulus (GPa)
4.6
3.2
3.1
3.6
Tensile strain (%)
4.9
1.7
6.3
6.0
Flexural strength (MPa)
163
100
140
--
Flexural modulus (GPa)
--
3.7
3.2
--
Flexural strain (%)
4.5
3.6
3.3
--
Strain energy release rate, G1 c kJ/m2
0.14
0.10
0.21
--
Notch sensitivity, K1 c Mpa.m1/2
1.04
0.50
0.85
1.71
Cured density g/cm3
1.25
1.24
1.21
1.25
Resin Tg (E' Onset)
Dry (ºF/ºC)
518/270
345/174
374(2)/190
316/158
Wet (ºF/ºC)
405/207
300/177
334(2)/168
~266

Notes:

(1) CYCOM 5250-4 RTM standard cure/postcure cycles. Alternatives are possible depending on final performance requirements.

(2) CYCOM 890 RTM Tg values quoted are without optional postcure. Tg values with postcure are 415ºF/213ºC dry and 359ºF/182ºC wet.

 
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