Cytec Carbon Fibers
ThermalGraph®DKD
ThermalGraph DKD is a pitch-based high thermal
conductivity fiber developed for thermal management
applications. The fiber has a longitudinal thermal conductivity
50% higher than copper and a tensile modulus in excess
of 100 Msi. The discontinuous nature of the fiber allows
a free flowing product form which can be blended and
compounded with other materials.
| Fiber Properties |
|
| Reported
Fiber Properties |
Range |
| Electrical
Resistivity |
< 3.0 micro ohm-m |
| Bulk
Density |
0.25 - 0.55 g/cc |
| Characteristic
Fiber Properties |
| Estimated
Thermal Conductivity |
400 - 700 W/mK |
| Average
Filament Length |
200 microns |
| Filament
Diameter |
10 microns |
| Filament
Length Distribution |
< 20% less
than 100 microns and
< 20% greater
than 300 microns |
| Tensile
Strength |
> 200 ksi |
| Tensile
Modulus |
100 -135 Msi |
| Fiber
Density |
2.15 - 2.25 g/cc |
| Carbon
Assay |
99+% |
| Surface
Area |
0.4 m²/g |
| CTE
at 21°C |
-1.45 ppm/°C |
|
Packaging
Discontinuous fiber is packaged in polyethylene bags and
packed in cardboard containers
holding up to 50 pounds.
Safety Information
Material Safety Data Sheet (MSDS) is available and should
be read and understood prior to use of this product.
Thornel and ThermalGraph are registered trademarks, and
EnerGraph is a trade mark of Cytec Carbon Fibers LLC.
Technical information contained herein is furnished without
charge or obligation and is given and accepted at recipient's
sole risk. Because conditions of use may vary and are
beyond our control, Cytec Carbon Fibers LLC makes no representation
about, and is not responsible or liable for the accuracy
or reliability of data, nor toxicological effects or industrial
hygiene requirements associated with particular uses of
any product described herein. Nothing contained in this
document shall be considered a recommendation for any
use that may infringe patent rights, or an endorsement
of any particular material, equipment, service, or other
item not supplied by Cytec Carbon Fibers LLC. The properties
and applications listed in this document are not specification.
They are provided as information only and in no way modify,
amend, enlarge or create any specification or warranty. |
