Cytec Engineered Materials
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FM® 57 Film Adhesive

Click here to view the datasheet (Adobe Acrobat file).

FM 57 film adhesive is a condensation polyimide adhesive supplied as a supported film with a woven fiberglass carrier. FM 57 does not contain MDA. It is suitable for bonding metallic and non-metallic substrates as well as honeycomb structures.

FM 57 film adhesive can be processed at 350°F/177°C with a freestanding post cure at 550°F/288°C. This adhesive film provides a service temperature of -67°F/-55°C to 550°F/288°C and can be used for repair and radar transparent applications.

Features and Benefits

  • Condensation polyimide
  • 550°F/288°C service temperature
  • 350°F/177°C processing
  • Does not contain MDA (methylene dianiline)
  • Suitable for honeycomb structure bonding

 


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