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CYCOM® 6070 Phenolic Resin

Click here to view the datasheet (Adobe Acrobat file).

CYCOM 6070 is a 280 to 320°F (138 to 160°C) curing phenolic resin. It has a service temperature up to 500°F/260°C when stepwise post-cured at 450°F/232°C. It can be processed by vacuum bag, press, or autoclave methods. It is available on fiberglass, graphite or aramid woven broadgoods.

CYCOM 6070 is a self-extinguishing, low smoke, low heat release resin that is offered as both a tacky, drapeable prepreg for the fabrication of complex vacuum bag or autoclave cure parts, and as a tack-free prepreg for press cured parts. It was developed specifically for use in aircraft interior laminates and crushed-core panels.


Features and benefits:

  • 285-320°F (138-160°C) cure
  • 500°F (260°C) service temperature when post-cured
  • Vacuum bag, press, or autoclave cure cycles
  • Developed specifically for aircraft interior laminates and crushed-core panels
  • Self-extinguishing
  • Low smoke
  • Laminate and sandwich panel usage
  • Shelf life: 6 months at 0°F (-18°C); 10 days at 72°F (21°C)
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